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    1. EN
      EN

      封裝圖

      您值得信賴的專業半導體供應商

      封裝圖

      您值得信賴的專業半導體供應商

      封裝圖

      您值得信賴的專業半導體供應商

      DIP

      DIP8

      DIP14

      DIP16

      DIP24

      Dual In-line Package Pitch 2.54 mm

      DIP8

      DIP14

      DIP16

      DIP24 (WIDE)

      SOP

      SOIC127P600-8

      SOIC127P600-14

      SOIC127P600-16


      Small-outline integrated circuit

      Standard 50 mil Pitch SOICs

      SOIC-8 (SO-8)

      SOIC-14 (SO-14)

      SOIC-16 (SO-16)

      SOIC127P1030-16

      SOIC127P1030-20

      SOIC127P1200-24

      Small-outline integrated circuit

      Nonstandard 50 mil Pitch SOICs

      TSOP65P490-8

      TSOP65P640-14

      TSOP65P640-16

      Thin Small Outline Packages

      Pitch 0.65 mm

      TSSOP50P490-10


      Thin Shrink Small Outline Package

      10 Pin Pitch 0.5 mm

      TSSOP50P1600-24

      TSSOP50P1600-32

      TSSOP40P1800-40

      Thin Shrink Small Outline Package

      Pitch 0.4, 0.5 mm

      QFP

      TQFP80P900X900-32

      TQFP80P1600X1600-64

      TQFP65P1200X1200-52

      TQFP100P1600X1600-44

      Thin Quad Flat Package

      Height < 1.6 mm

      Pitch 0.65, 0.8, 1.0 mm

      TSQFP50P700X700-32

      TSQFP50P900X900-48

      TSQFP40P900X900-64

      TSQFP40P1200X1200-80

      Thin Shrink Quad Flat Package

      Height < 1.6 mm

      Pitch 0.4, 0.5 mm

      TSQFP40P1600X1600-120

      TSQFP40P1600X1600-128

      TSQFP50P1600X1600-100

      TSQFP50P2200X2200-144

      Thin Shrink Quad Flat Package

      Height < 1.6 mm

      Pitch 0.4, 0.5 mm

      Pin >100

      PLCC-68

      PLCC-68

      Plastic Leaded Chip Carrier

      PLCC-68

      SIM900

      SIM900

      Ultra compact and reliable wireless module

      QFN

      QFN50P700X700-44

      QFN40P800X800-68

      Quad Flat No leads Packages

      QFN-44 Pitch 0.5 mm

      QFN-68 Pitch 0.4 mm

      QFN50P300X300-10-2

      QFN50P300X300-10-2

      Quad Flat No leads

      QFN-12 (10+2 Pin)

      SOT50P240-8

      SOT50P240-8

      SOT Generic Package 0.5 mm Pitch

      RESC

      RESC1005

      RESC1608

      RESC2012

      RESC3216

      Surface Mount Chip Resistor

      0402.STEP 1.0mm x 0.5mm

      0603.STEP 1.6mm x 0.8mm

      0805.STEP 2.0mm x 1.25mm

      1206.STEP 3.2mm x 1.6mm

      RESM

      RESM3,2X1,5

      RESM6X2,3

      RESM7,5X2,5

      RESM9X3,2

      Through Hole Resistors

      3.2mm x 1.5mm

      6.0mm x 2.3mm

      7.5mm x 2.5mm

      9.0mm x 3.2mm

      3224X

      3224X

      TRIMMER (4.8x3.5x5.1)mm SMD Bourns


      3296W

      3296W

      TRIMMER (9.53x4.83x10.03)mm SMD Bourns


      3303W

      3303W

      TRIMMER (3.75x3.01.55)mm SMD Bourns

      SQP

      SQP-3

      SQP-5

      Wirewound Leaded Resistor

      3W, 22.00mm x 8.00mm

      5W, 22.00mm x 9.50mm

      B57164K

      B57164K

      THERMISTOR NTC RADIAL


      CAPC

      CAPC1608

      CAPC2012

      CAPC3216

      CAPC3225

      CERAMIC CHIP CAPACITORS

      0603.STEP 1.60mm x 0.80mm

      0805.STEP 2.00mm x 1.20mm

      1206.STEP 3.20mm x 1.60mm

      1210.STEP 3.20mm x 2.50mm

      CAPCP

      TC3216-18

      TC3528-21

      TC6032-28

      TC7343-31

      Molded Tantalum Surface Mount Capacitors

      3.20mm x 1.60mm

      3.50mm x 2.80mm

      6.00mm x 3.20mm

      7.30mm x 4.30mm

      CASE A

      CASE B

      CASE C

      CASE D

      CASE A.STEP 3.20mm x 1.60mm

      CASE B.STEP 3.50mm x 2.80mm

      CASE C.STEP 6.00mm x 3.20mm

      CASE D.STEP 7.30mm x 4.30mm

      ECE

      ECE A

      ECE B

      ECE C

      ECE D

      SMT Aluminum Electrolytic Capacitors

      Size A 3.30mm x 3.30mm h 5.40mm

      Size B 4.30mm x 4.30mm h 5.40mm

      Size C 5.30mm x 5.30mm h 5.40mm

      Size D 6.60mm x 6.60mm h 5.40mm

      TZB4A

      TZB4A

      CAP TRIMMER SMD 4.00mm x 4.00mm

      D2Pak (TO-263AB)

      D2Pak (TO-263AB)

      D-Pak (TO-252AA)

      D-Pak (TO-252AA)

      I-Pak (TO-251AA)

      I-Pak(TO-251AA).Straight

      I-Pak(TO-251AA).PCB TH

      SMA (DO-214AC)

      SMA (DO-214AC)

      Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 5.5x2.8 mm

      地址:江蘇省南京市江北新區平江大街21號綠地國際金融天際商業中心A4棟領匯2604室 電話:025-82229538 82229638 郵箱:hser@hser.com.cn

      Copyright? 2022南京匯賽電子科技有限公司 蘇ICP備17041144號-1   網站建設龍媒網絡

      地址:江蘇省南京市江北新區平江大街21號綠地國際金融天際商業中心A4棟領匯2604室

      電話:025-82229538 82229638

      郵箱:hser@hser.com.cn

      微信公眾號

      Copyright? 2022南京匯賽電子科技有限公司 蘇ICP備17041144號-1

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